Reliability Technology for Integrated Circuit by Bin Zhou (.ePUB)+
File Size: 160.4 MB
Reliability Technology for Integrated Circuit Packaging by Bin Zhou, Yunfei En, Si Chen
Requirements: .ePUB, .PDF reader, 160.4 MB | True PDF, True EPUB
Overview: This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress. Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. The reliability of integrated circuit (IC) packaging is a systematic engineering endeavor involving multiple aspects such as materials, processes, structures, and operating environments. In China’s pursuit of “high-quality development” a focus on reliability is essential to advancing manufacturing. Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China’s electronic information industry.
Genre: Non-Fiction > Tech & Devices
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